Past conferences, workshops, symposia
- 13-16 May 2018: 10th IEEE International Memory Workshop, Kyoto, Japan
- 4-6 June 2018: International Conference on IC Design and Technology (ICICDT), Otranto, Italy
- 4-14 June 2018: CIMTEC 2018-8th Forum on New Materials, Perugia, Italy
- 16-21 September 2018: Conference on Radiation Effects on Components and Systems (RADECS), Gothenburg, Sweden
- 24-26 September 2018: 2018 International Conference on Simulation of Semiconductor Processes and Devices, Austin, USA
- 1-5 October 2018: 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Aalborg, Denmark
- 22-24 October 2018: 18th Non-Volatile Memory Technology Symposium (NVMTS), Sendai, Japan
- 20-22 November 2018: European Forum for Electronic Components and Systems (EFECS), Lisbon, Portugal
- 1-5 December 2018: IEEE International Electron Devices Meeting (IEDM), San Francisco, USA WAKeMeUP was at the 2018 IEDM, the world's pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electron device technology, design, manufacturing, physics, and modeling, and presented the following papers:
7.4 Embedded Select in Trench Memory (eSTM), best in class 40nm floating gate based cell: a process integration challenge (Invited) -- STMicroelectronics.
This paper discusses an innovative architecture of charge storage NVM cell, which outpaces state-of-the-art in term of bit-cell area. This new concept of memory cell is used today in production for microcontrollers. After cell architecture and activation description, we will present process flow integration challenges, process optimizations and single cell characterizations. © IEDM 2018 Conference
18.4 Truly Innovative 28nm FDSOI Technology for Automotive Micro-Controller Applications embedding 16MB Phase Change Memory -- STMicroelectronics
For the first time we propose a 28nm FDSOI e-NVM solution for automotive micro-controller applications using a Phase Change Memory (PCM) based on chalcogenide ternary material. A complete array organization is described exploiting body biasing capability of Fully Depleted Silicon On Insulator (FDSOI) transistors. Leveraging triple gate oxide integration with high-k metal gate (HKMG) stack, a true 5V transistor with high analog performance has been demonstrated. Reliable PCM 0,036um2 analytical cell with 2 decades programming window after 1 Million of cycles has been demonstrated. Finally, current distributions based on a fully integrated 16MB macro-cell is presented achieving Bit Error Rate (BER) < 10-8 after multiple bakes at 150°C and 10k cycling of code storage memory. © IEDM 2018 Conference - 5-8 December 2018: 49th IEEE Semiconductor Interface Specialists Conference (SISC), San Diego, USA
- 12-15 May 2019: 11th IEEE International Memory Workshop, Monterey, USA
- 17-19 June 2019: 2019 IEEE International Conference on IC Design and Technology (CICDT), Suzhou, China
- 12/09/2019-12/11/2019: 2019 65th IEEE International Electron Devices Meeting (IEDM), San Francisco, USA
WAKeMeUP presented 2 scientific papers from CEA-Leti:
35.3: "Reliability and Variability of 1S1R OxRAM-OTS for High density crossbar Integration", D. Alfaro Robayo, G. Sassine, J. Minguet Lopez, L. Grenouillet, A. Verdy, G. Navarro, M. Bernard, E. Esmanhotto, C. Carabasse, E. Vianello, N. Castellani, L. Ciampolini, B. Giraud, C. Cagli, G. Guibaudo, E. Nowak, G. Molas,
30.5: “OxRAM for embedded solutions on advanced node: scaling perspectives considering statistical reliability and design constraints”, J. Sandrini, L. Grenouillet, V. Meli, N. Castellani, I. Hammad, S. Bernasconi, F. Aussenac, S. Van Duijn, G. Audoit, M. Barlas, J.F. Nodin, O. Billouint, G. Molas, R. Fournel, E. Nowak, F. Gaillard, C. Cagli
- 19-21 November 2019: 2019 European Forum for Electronic Components and Systems (EFECS), Helsinki, Finland
- 17-20 May 2020: International Memory Workshop (IMW) (remote event) (CEA-LETI)
- 19-23 July 2020: International Symposium on Applications of Ferroelectrics (ISAF) (remote event) (Fraunhofer-IPMS)
- 04-07 August 2020: Microscopy & Microanalysis 2020 Meeting (remote event) (TU-DARM)
- 10-13 August 2020: 2020 International Symposium on VLSI Technology, Systems and Applications (remote event) (CEA-LETI)
- 31/08-04/09/2020: EUROSOI-ULIS conference (Caen, France) https://eurosoiulis2020.sciencesconf.org/
- 22-25 September 2020: Materials Science and Engineering Congress (MSE) (remote event) (TU-DARM)
- 04-08 October 2020: ESREF 2020, the 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (CEA-LETI)
- 19 October - 20 November 2020: RADECS 2020 Conference
- 25-26 November 2020: EFECS 2020 (remote event): WAKeMeUP booth
- 21-25 March 2021: International Reliability Physics Symposium 2021 (IRPS)
- 16-19 May 2021: International Memory Workshop (IMW) 2021
- 16-21 May 2021: International Symposium on Applications of Ferroelectric (ISAF) 2021
- 31 May - 3 June 2021: European Materials Research Society (E-MRS)
- 1-5 August 2021: Microscopy & Microanalysis Conference 2021
